29 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module connector for w-sim SCZA s eries high reliability contact structure best fit for portable devices. improved operability from long ejection stroke (5mm) and clear click feel. good operational feel. double contact-point for power and ground reduces risk of temporary power failure. compact and low-profile suitable for portable devices. ? ? ? ? features for mobile phones, pcs, and personal digital assistants ? applications tray w-sim standard mount surface mounting type push-push type, manual insertion/removal 500v ac 1minute applicable media structure items specifications media ejection structure mounting type mounting style 20 ? to 60 ? 1,000m
min. 100m
max. 10,000cycles operating temperature range performance contact resistance initial insertion and removal cycle voltage proof insulation resistance initial typical specifications media ejection structure push-push type standard mount mounting system features without boss l type with boss l type without boss 0.6mm type with boss 0.6mm type without boss 1.2mm type with boss 1.2mm type with boss l type without boss 0.6mm type stand-off mm 0 packing system SCZA1a0100 product no. 1 SCZA1a0200 2 SCZA1a0300 3 SCZA1a0400 4 SCZA1a0500 5 SCZA1a0600 6 manual insertion/removal SCZA2a0100 7 SCZA2a0200 8 drawing no. product line
30 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick connector for w-sim SCZA series card center eject travel(5) over travel (1.20) connector center connector center 30.2 29.5 4.65 0.6 23 4.2 v 1 c 0.1 (44.6) 13.65 4-2 1.45 29.2 1.3 31.3 (11) 0.6 (1) center of gravity ( vacuum point ) 18-0.4 1.125 2.275 3.425 4.575 5.725 6.875 8.025 9.175 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 pc board mounting hole dimensions viewed from the mounting face side no. style no parts area no pattern area land area 15.95 min. 14.25 max. 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 15.95 min. 14.25 max. 13 min. 15.05 min. 15.05 min. 10.4 min. 14.25 max. 14.25 max. 15.95 min. 15.95 min. 9.3 min. 2.1 min. 4-2.6 min. 2.4 30.1 6.7 max. dimensions unit:mm 1 push-push type without boss l type 2 push-push type with boss l type no part area land no pattern area 15.95 min. 14.25 max. 15.95 min. 14.25 max. 18-0.8 min. 5.1 23 9.3 min. 6.7 max. 13 min. 15.05 min. 14.25 max. 15.95 min. 15.95 min. 14.25 max. 15.05 min. 10.4 min. 2.1 min. 2.4 v 1.4 v 1.1 13.65 30.1 4- 2.6 min. 1.125 2.275 3.425 4.575 5.725 6.875 8.025 9.175 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 1.1 connector center connector center card center 4.65 over travel (1.2) eject travel(5) 1.3 31.3 (44.6) 30.2 0.6 29.5 center of gravity (vacuum point) (1) 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 4-2 29.2 1.45 (11)
31 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module 9.3 min. 4-2.5 27.7 2.4 2.1 min. 6.7 min. 14.675 15.05 min. hole 13 min. 10.4 min. 4-1.1 4-0.5 1.125 2.275 3.425 4.575 5.725 6.875 8.025 9.175 15.05 min. 29.35 4-r0.5 4-r0.2 no part area land no pattern area 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 4-1.9 pc board mounting hole dimensions viewed from the mounting face side no. style dimensions unit:mm 3 push-push type without boss 0.6mm type 4 push-push type with boss 0.6mm type 9.3 min. 4-2.5 27.7 2.4 2.1 min. 6.7 max. 14.675 15.05 min. 15.05 min. hole 13 min. 10.4 min. 4-1.1 4-0.5 1.125 5.1 1.1 2.275 3.425 4.575 5.725 6.875 8.025 9.175 29.35 4-r0.2 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 4-1.9 13.65 1.1 1.4 23 no part area land no pattern area 4-r0.5 no part area land no pattern area center of gravity (vacuum point) 29.5 (1) (11) 4-1.4 1.45 27.7 0.6 30.2 (44.6) (5) (1.20) 4.65 over travel eject travel card center connector center 29.2 1.3 a l p s 4-0.6 connector center 18-0.4 1.125 2.275 3.425 4.575 5.725 6.875 8.025 9.175 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 connector center 18-0.4 1.125 2.275 3.425 4.575 5.725 6.875 8.025 9.175 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 a l p s 4.65 0.6 30.2 29.5 (1) c0.1 (11) 4-1.4 1.45 27.7 4-0.6 0.6 23 4.2 center of gravity (vacuum point) 1 over travel (1.20) eject travel (5) (44.6) 1.3 connector center card center 13.65 29.2 connector for w-sim SCZA series
32 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick pc board mounting hole dimensions viewed from the mounting face side no. style dimensions unit:mm 5 push-push type without boss 1.2mm type 6 push-push type with boss 1.2mm type 9.3 min. 4-2.5 27.7 2.4 2.1 min. 6.7 min. 14.675 15.05 min. holes 13 min. 10.4 min. 4-1.1 4-0.5 1.125 2.275 3.425 4.575 5.725 6.875 8.025 9.175 15.05 min. 29.35 4-r0.5 4-r0.2 no part area land no pattern area 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 4-1.9 (1.20) over travel (5) eject travel card center connector center connector center 29.2 4.65 23 4.2 13.65 0.1 c 27.7 4- 1.45 1 0.6 1.2 4- center of gravity (vacuum point) 1.3 0.6 30.2 29.5 (1) (44.6) 0.4 18- 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 1.4 (11) 9.3 min. 4-2.5 27.7 2.4 2.1min. 5.1 23 6.7 min. 14.675 15.05min. hole 13min. 10.4min. 4-1.1 4-0.5 1.1 1.125 2.275 3.425 4.575 5.725 6.875 8.025 9.175 15.05min. 29.35 4-r0.5 4-r0.2 land no pattern area no part area 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 4-1.9 1.1 (1.20) over travel (5) eject travel card center connector center 0.4 18- 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 27.7 1.4 4- 1.45 1.2 4- center of gravity (vacuum point) 1.3 0.6 30.2 29.5 (1) (44.6) connector center 29.2 4.65 (11) connector for w-sim SCZA series
33 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module pc board mounting hole dimensions viewed from the mounting face side no. style dimensions unit:mm 7 manual insertion/removal with boss l type 8 manual insertion/removal without boss 0.6mm type
8.05 min. 7.65 min. 5.55 max. 1.55 max. 1.90 2.50 4-r 0.20 1.10 0.50 :no part area :land :no pattern area 23.40 min. 27.80 min. 4.85 1.80 18- 0.80 1.45 min. 26.55 20.95 18.65 16.35 14.05 11.75 9.45 7.15
connector for w-sim SCZA series
50 for sd memory card for microsd card for sim card 8pins for w-sim for memory stick micro combine type for express card for compact flash for pc cards supporting cardbus for cmos camera module for memory stick soldering conditions example of reflow soldering condition reference 1. heating method: double heating method with infrared heater. 2. temperature measurement: thermocouple 0.1 to 0.2 ca k or cc t . 3. temperature profile surface of products 200 100 240 ? (max.) 230 ? (min.) 150 ? 180 ? time (s) 10 sec.(max.) 90 ? 30 sec. room temperature temperature (?c ) pre-heating heating time sec. 1. when soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. caution is therefore required. 2. avoid use of water-soluble soldering flux, since it may corrode the product. 3. check and conform to reflow soldering requirements under actual mass production conditions. 4. pc board warping may alter the characteristics. please take this into consideration when designing patterns and layout. 5. the card specifications are provided by the above manufactures. products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. cautions for using this product small memory card connectors
|
